jar546
Forum Coordinator
Here's an educational summary in bullet point format concerning NEC code 680.26(B)(2) on perimeter surfaces around pools and spas:
- Perimeter Surface Definition and Extension:
- The bonding perimeter surface extends 900 mm (3 ft) horizontally beyond the inside pool walls.
- It is at a height between 900 mm (3 ft) above and 600 mm (2 ft) below the maximum water level.
- Includes unpaved surfaces, concrete, and other paving types.
- Surfaces separated by a permanent wall or building over 1.5 m (5 ft) high require bonding only on the pool side.
- Bonding Requirements:
- Bonding to perimeter surfaces follows specifications in sections 680.26(B)(2)(a), (b), (c), and (d).
- For conductive pool shells, bonding attaches to pool reinforcing steel or copper conductor grid at a minimum of four points around the perimeter.
- Nonconductive pool shells don't require bonding at four points; perimeter bonding attaches to an 8 AWG copper conductor.
- Conductive Paved Portions:
- Bonded with structural steel or welded wire mesh, fully embedded unless not feasible.
- If steel is non-present, encapsulated, or embedding not possible, a copper conductor grid or unencapsulated welded wire reinforcement under paving within 150 mm (6 in.) of grade is used.
- Listed for corrosion resistance and performance by January 1, 2025.
- Unpaved Portions:
- Bonded with at least one 8 AWG solid copper conductor.
- Conductors follow perimeter contour, placed 100 mm to 150 mm (4 in. to 6 in.) below grade.
- Installed in areas not directly accessed by swimmers.
- Nonconductive Perimeter Surfaces:
- Equipotential bonding not required if separated from earth or on nonconducting supports.
- Applies to materials like wood, plastic, and composites.
- Interconnection of Bonded Surfaces:
- Interconnected using splicing devices or welding.
- Utilizes solid copper wire, not smaller than 8 AWG, potentially encircling the pool for connection facilitation.
- Enhanced Content Note:
- Bonding applies to all perimeter surfaces, paved or unpaved.
- The bonding grid may comprise structural metal or a solid 8 AWG copper conductor.
- The grid follows perimeter contours with specific installation guidelines.
- Nonconductive decks don't require bonding but the surface underneath does if the pool is installed on or partially in the ground.