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Bonding of Perimeter Surfaces Around Pools and Spas Based on 2023 Section NEC 680.26(B)(2)

jar546

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Here's an educational summary in bullet point format concerning NEC code 680.26(B)(2) on perimeter surfaces around pools and spas:
  • Perimeter Surface Definition and Extension:
    • The bonding perimeter surface extends 900 mm (3 ft) horizontally beyond the inside pool walls.
    • It is at a height between 900 mm (3 ft) above and 600 mm (2 ft) below the maximum water level.
    • Includes unpaved surfaces, concrete, and other paving types.
    • Surfaces separated by a permanent wall or building over 1.5 m (5 ft) high require bonding only on the pool side.
  • Bonding Requirements:
    • Bonding to perimeter surfaces follows specifications in sections 680.26(B)(2)(a), (b), (c), and (d).
    • For conductive pool shells, bonding attaches to pool reinforcing steel or copper conductor grid at a minimum of four points around the perimeter.
    • Nonconductive pool shells don't require bonding at four points; perimeter bonding attaches to an 8 AWG copper conductor.
  • Conductive Paved Portions:
    • Bonded with structural steel or welded wire mesh, fully embedded unless not feasible.
    • If steel is non-present, encapsulated, or embedding not possible, a copper conductor grid or unencapsulated welded wire reinforcement under paving within 150 mm (6 in.) of grade is used.
    • Listed for corrosion resistance and performance by January 1, 2025.
  • Unpaved Portions:
    • Bonded with at least one 8 AWG solid copper conductor.
    • Conductors follow perimeter contour, placed 100 mm to 150 mm (4 in. to 6 in.) below grade.
    • Installed in areas not directly accessed by swimmers.
  • Nonconductive Perimeter Surfaces:
    • Equipotential bonding not required if separated from earth or on nonconducting supports.
    • Applies to materials like wood, plastic, and composites.
  • Interconnection of Bonded Surfaces:
    • Interconnected using splicing devices or welding.
    • Utilizes solid copper wire, not smaller than 8 AWG, potentially encircling the pool for connection facilitation.
  • Enhanced Content Note:
    • Bonding applies to all perimeter surfaces, paved or unpaved.
    • The bonding grid may comprise structural metal or a solid 8 AWG copper conductor.
    • The grid follows perimeter contours with specific installation guidelines.
    • Nonconductive decks don't require bonding but the surface underneath does if the pool is installed on or partially in the ground.
 
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